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The constant-temperature pressurization chamber is equipment for uniform pressure and temperature processes, suitable for lamination and forming processes.

It is suitable for touch screen or small LCD film bonding, and it is also suitable for various fields in the developed semiconductor parts industry.

 

内部循环图

Touch Panel,小型LCD连接用 Autoclave / 半导体包装产业部分发达,适用于多种产品。 需要多张Film的接合,除掉Film层间的气泡很重要。 另外,在温度和压力之外,采用冷却方式,可提高气泡去除及挤压力。

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MLCC/LTCC/HTCC
Food & Beverag
Semi-conductor/ Display
Mixing & Homogenization
제품명
Multi-Layer Ceramic Capacitors

적층세라믹캐퍼시터

전자기기 내 전류 흐름과 신호 전달을 원활하게 하는 부품입니다. 반도체와 전자회로가 있는 제품에는 대부분 들어갑니다. MLCC는 이상적인 SMD(Surface Mount Devices)를 형성하며 통신, 자동차 및 엔터테이먼트 전자 제품에 활용됩니다.

MLCC +

LTCC
Low Temperature Co-fired Ceramic

저온 동시 소성 세라믹

다층의 세라믹 기판 내에 저항, 인덕터, 캐퍼시터의 수동 소자를 한 개의 칩(Chip) 형태로 구현할 수 있는 세라믹 소재 또는 기술을 의미합니다.

LTCC +

제품명
High Temperature Co-fired Ceramic

고온 동시 소성 세라믹

LTCC와 더불어전자패키징에서다기능, 고신뢰성회로기판및복합module을 실현할 수 있는 기술입니다. 향후에도 이러한 HTCC 패키지 제품들은 고신뢰성이 요구되는 응용분야인 국방용 전자, 적외선 센서, 우주항공 분야, 통신용 광전 하우징(optoelectronics housing), 의료용 multichip기기 등 고부가가치 산업으로 응용분야가 확대되는 추세이다.

HTCC +

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  • Product Name : Pressurized oven for FA series film bonding

    • Product Summary : It is applied to the lamination process that requires the joining of multiple films, and improves the performance by uniforming the layers by removing bubbles between the film layers.
    • Application field : Autoclave for bonding films to touch panels or small LCD panels

  • Product Name : Pressurized oven for HA series semiconductor packaging

    • Product Summary : It is a facility that removes internal bubbles and voids through isotropic compression at a certain pressure using gas while curing epoxy resin. Process efficiency is high by simultaneously curing and defoaming processes.
    • Application field : Pressurized oven that can be used at high temperatures, mainly used for semiconductor packing process

  • Product Name : GA Series Pressurized Oven for Glazing

    • Product Summary : Facility to achieve homogenization and densification by applying pressure in the same direction while maintaining a constant temperature
    • Application field : Applied to heat treatment and laminated glass process of glass surface such as tempered glass and pair glass

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