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Product Name : Pressurized oven for FA series film bonding
- Product Summary : It is applied to the lamination process that requires the joining of multiple films, and improves the performance by uniforming the layers by removing bubbles between the film layers.
- Application field : Autoclave for bonding films to touch panels or small LCD panels
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Product Name : Pressurized oven for HA series semiconductor packaging
- Product Summary : It is a facility that removes internal bubbles and voids through isotropic compression at a certain pressure using gas while curing epoxy resin. Process efficiency is high by simultaneously curing and defoaming processes.
- Application field : Pressurized oven that can be used at high temperatures, mainly used for semiconductor packing process
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Product Name : GA Series Pressurized Oven for Glazing
- Product Summary : Facility to achieve homogenization and densification by applying pressure in the same direction while maintaining a constant temperature
- Application field : Applied to heat treatment and laminated glass process of glass surface such as tempered glass and pair glass