Product Name : Pressurized oven for FA series film bonding

• Product Summary : It is applied to the lamination process that requires the joining of multiple films, and improves the performance by uniforming the layers by removing bubbles between the film layers.
• Application field : Autoclave for bonding films to touch panels or small LCD panels

Product Name : Pressurized oven for HA series semiconductor packaging

• Product Summary : It is a facility that removes internal bubbles and voids through isotropic compression at a certain pressure using gas while curing epoxy resin. Process efficiency is high by simultaneously curing and defoaming processes.
• Application field : Pressurized oven that can be used at high temperatures, mainly used for semiconductor packing process

Product Name : GA Series Pressurized Oven for Glazing

• Product Summary : Facility to achieve homogenization and densification by applying pressure in the same direction while maintaining a constant temperature
• Application field : Applied to heat treatment and laminated glass process of glass surface such as tempered glass and pair glass