Suitable for touch screen, small LCD film lamination / suitable for various fields in the developed semiconductor parts industry.
Pressure Curing Oven (PCO: Pressure Curing Oven): The process of applying equalizing pressure and heating, applied to the lamination molding process. Mainly used for
the bonding of semiconductors, touch panels and small LCD panels. In the film bonding process or chip bonding and underfill applications,
PCO can reduce tiny bubbles and increase adhesion strength. Most bubbles can be eliminated. Put the touch screen with bubbles in the device, close the feeding door of the device and press the start button and wait for a while.
- FA film bonding
- HA Semiconductor Industry