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Semi-conductor/ Display

Semi-conductor/ Display

Suitable for touch screen, small LCD film lamination / suitable for various fields in the developed semiconductor parts industry.

Pressure Curing Oven (PCO: Pressure Curing Oven): The process of applying equalizing pressure and heating, applied to the lamination molding process. Mainly used for the bonding of semiconductors, touch panels and small LCD panels. In the film bonding process or chip bonding and underfill applications, PCO can reduce tiny bubbles and increase adhesion strength. Most bubbles can be eliminated. Put the touch screen with bubbles in the device, close the feeding door of the device and press the start button and wait for a while.

FA film bonding
HA Semiconductor Industry
  • 01

    FA film bonding

  • 02

    GA glass bonding

  • 03

    HA semiconductor packaging

Constant temperature pressurized room?

Touch screen and small LCD panel laminating film, semiconductor industry, heat treatment of glass surface and removal of bubbles.

APPLICATION

Multi-Layer Ceramic Capacitors

积层陶瓷散热器

电子设备内信号转导和电流流动顺畅的零部件。 芯片和电路的产品,大部分人进入。 是理想的MLCC(Mount Surface Devices),SMD通讯、汽车电子产品及用于公司然后。

MLCC +

Low Temperature Co-fired Ceramic

低温同时小声陶瓷

指的是在多层陶瓷基盘内,以一个芯片(Chip)形态实现阻抗,滴管,开具的手动元件的陶瓷材料或技术。

MLCC +

High Temperature Co-fired Ceramic 高温同时小声陶瓷

与LTCC一起在电子包装上实现多功能,高可靠性电路板판复合module的技术。 今后,这些HTCC成套产品仍将是国防用电子,红外线传感器,宇宙航空领域,通信用光电应用等高附加价值产业,用于医疗。

MLCC +